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        Home  > Industry news

        What changes when dual axle feedthroughs enter plasma etching systems

        2026-06-08

        The vacuum feedthrough requirement in plasma etching

        Plasma etching systems, fundamental to semiconductor and flat panel display (FPD) manufacturing, require precise rotational motion control inside a vacuum chamber. This is where magnetic fluid rotary feedthroughs are applied. According to industry listings, these components are common in processes like sputtering, chemical vapor deposition, and specifically plasma etching. The manufacturing of high-resolution smartphone displays demands more refined processes and better system yield, which places greater demands on the reliability of every component, including feedthroughs.

        Technical demands on the seal

        The operating environment defines the feedthrough's specifications. For high-end vacuum applications, stability in ultra-high vacuum conditions up to 1×10⁻⁹ Pa is necessary. This prevents outgassing or particle generation that could contaminate the process. Perhaps more critically for plasma etching is the need for sealing against reactive, or corrosive, gases. The plasma environment often uses aggressive chemistries that can degrade conventional seals. A feedthrough must maintain integrity here without introducing contaminants.

        Industry reliance on proven expertise

        Market leadership in this niche relies on extensive vacuum technology expertise. Leading suppliers leverage decades of experience, some over 30 years, in developing magnetic fluid feedthroughs. This long-term technical know-how supports the creation of systems with precision rotational control and reliable vacuum integrity. These companies maintain advantages through global semiconductor manufacturing networks and full integration capabilities, which support customer loyalty.

        The dual axle advantage

        A dual axle configuration addresses a specific need: independent control of two rotational axes through a single vacuum boundary. In a plasma etch system, this could allow for the simultaneous positioning of a substrate and a separate shielding component. The core sealing technology remains the same, using a ferrofluid held in place by magnetic fields. The design challenge multiplies, requiring the same ultra-high vacuum performance and resistance to corrosive process gases across two independent rotating shafts. This design approach provides engineers with more flexible motion solutions within the constrained space of a vacuum chamber.

        We develop and supply these specialized dual axle ferrofluid feedthroughs for applications requiring such complex motion control under vacuum.

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